According to Moore’s law the density of chips in microprocessors keep doubling every two years. With the increasing density and effectiveness of the current chips the amount of heat generated by these chips is also increasing. To cope with the enormous heat, new technologies will be needed in the future to cool the integrated chips that produces much more heat than the current microprocessors.
Such a new technology has been developed at Purdue University that uses “microjets” to deposit liquid into tiny channels. This technology is able to remove five times more heat than other experimental high-performance chip-cooling methods.
The conventional computer chips usually generate about 100 watts per square centimeter. The chips are air-cooled with finned metal plates called heat sinks and often a small CPU fan. Most of the liquid-cooling techniques are limited to a cooling capacity of about 200 watts per square centimeter. However the new microjet technology is able to cool chips that generate more than 1,000 watts of heat per square centimeter. With its help new doors in the advancement of chips technology can be opened.
This technology is a combination of two cooling methods, the microjets and microchannels, hence called a hybrid system. The microjets cools unif